型号 |
外部尺寸(mm) |
工作温度(℃) |
频率范围 |
PDF下载 |
12MHz贴片晶振,E3FB12E000019E,HOSONIC晶振,HCX-3FB,3225贴片晶振 |
3.2×2.5×0.9mm |
|
12MHz |
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27MHz贴片晶振,E3FB27.0000F18E33,HCX-3FB,18pF,3225晶振,鸿星晶振,30ppm |
3.2×2.5×0.9mm |
|
27MHz |
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鸿星晶振,24MHz贴片晶振,3225晶振,E3FB24.0000F18E33,30ppm,18pF,HCX-3FB |
3.2×2.5×0.9mm |
|
24MHz |
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E3FB16.0000F18E33,HCX-3FB,鸿星晶振,16MHz贴片晶振,3225封装,18pF,30ppm |
3.2×2.5×0.9mm |
|
16MHz |
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E3FB12.0000F18E33,鸿星晶振,12MHz晶振,HCX-3FB,3225贴片晶振,18pF,30ppm |
3.2×2.5×0.9mm |
|
12MHz |
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24MHz晶振,E3FB24E00000KE,HOSONIC晶振,12PF,30PPM,3225贴片陶瓷面晶振 |
3.2×2.5×0.9mm |
|
24MHz |
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16MHz贴片晶振,E2SB16.0000F12E33,鸿星晶振,2520晶振,12PF,30PPM |
2.5×2.0×0.65mm |
|
16MHz |
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19.2MHz晶振,E2SB19.2000F08E11,2520封装,HOSONIC晶振,8PF,10PPM |
2.5×2.0×0.65mm |
|
19.2MHz |
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E2SB20.0000F09E11,20MHz贴片晶振,HOSONIC晶振,2520晶振,9PF,10PPM |
2.5×2.0×0.65mm |
|
20MHz |
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24MHz晶振,E2SB24.0000F09D11,鸿星晶振,9PF,10PPM,2520晶振 |
2.5×2.0×0.65mm |
|
24MHz |
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24.576MHz晶振,E2SB24.5760F18E33,2520晶振,18PF,30PPM,HOSONIC晶振 |
2.5×2.0×0.65mm |
|
24.576MHz |
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鸿星HOSONIC晶振,E2SB26.0000F09E11,2520晶振,26MHz手机晶振,9PF,10PPM |
2.5×2.0×0.65mm |
|
26MHz |
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HOSONIC鸿星晶振,E2SB27.0000F12E33,27MHz晶振,2520晶振,12PF,30PPM |
2.5×2.0×0.65mm |
|
27MHz |
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鸿星晶振,32MHz贴片晶振,E2SB32.0000F10E33,10PF,30PPM,2520晶振 |
2.5×2.0×0.65mm |
|
32MHz |
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20MHz晶振,E2SB20.0000F0SE11,2520晶振,HOSONIC鸿星晶振,10PPM |
2.5×2.0×0.65mm |
|
20MHz |
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16MHz蓝牙模块晶振,E2SB16.0000F10E11,10PF,10PPM,2520晶振,鸿星晶振 |
2.5×2.0×0.65mm |
|
16MHz |
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E2SB24.0000F10E11,24MHz晶振,2520晶振,鸿星晶振,10PPM,10PF |
2.5×2.0×0.65mm |
|
24MHz |
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27MHz晶振,鸿星晶振,2520晶振,E2SB27.0000F10E11,10PF,10PPM |
2.5×2.0×0.65mm |
|
27MHz |
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16MHz晶振,E2SB16.0000F12E33,HOSONIC晶振,12PF,30PPM,2520晶振 |
2.5×2.0×0.65mm |
|
16MHz |
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鸿星晶振,E2SB,26MHz晶振,E2SB26E000103E,10ppm,2520封装,7.5PF |
2.5×2.0×0.65mm |
|
26MHz |
PDF下载 |