型号 |
外部尺寸(mm) |
工作温度(℃) |
频率范围 |
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XYABELNANF-24.000000MHz,24MHz晶振,8PF,10PPM,TAITIEN泰艺晶振,2520封装 |
2.5×2.0×0.45mm |
|
24MHz |
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32MHz晶振,XYABBCNANF-32.000000MHz,2520封装,8PF,10PPM,TAITIEN晶振 |
2.5×2.0×0.45mm |
|
32MHz |
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27MHz晶振,2520贴片晶振,泰艺晶振,XYABBCNANF-27.000000MHz,8pF,±10ppm |
2.5×2.0×0.45mm |
|
27MHz |
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泰艺晶振,2520晶振,XYABBCNANF-25.000000MHz,25MHz晶振,8PF,10PPM |
2.5×2.0×0.45mm |
|
25MHz |
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24MHz晶振,XYABBCNANF-24.000000MHz,TAITIEN泰艺晶振,2520封装,10PPM,8PF |
2.5×2.0×0.45mm |
|
24MHz |
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XYABBCNANF-16.000000MHz,2520封装,16MHz晶振,TAITIEN晶振,8PF,10PPM |
2.5×2.0×0.45mm |
|
16MHz |
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XYBBCLNANF-38.400000MHz,2520封装,38.4MHz晶振,TAITIEN晶振,9PF,10PPM |
2.5×2.0×0.45mm |
|
38.4MHz |
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XZABBCNANF-32.000000MHz,32MHz晶振,TAITIEN泰艺晶振,8PF,10PPM,2016封装 |
2.0x1.6x0.45mm |
|
32MHz |
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16MHz蓝牙模块晶振,XZABBCNANF-16.000000MHz,8PF,10PPM,TAITIEN晶振,2016封装 |
2.0x1.6x0.45mm |
|
16MHz |
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12MHz有源晶振,OCETGLJANF-12MHZ,泰艺晶振,7050晶振,3.3V,50PPM,-40℃~+85℃ |
7.0x5.0x1.3mm |
|
12MHz |
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HCSL晶振,鸿星晶振,D3SL100E00000E,100MHz差分晶振,D3SL,3225晶振 |
3.2x2.5x1.2mm |
|
100MHz |
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D3SL27E000001E,鸿星晶振,HCSL晶振,27MHz差分晶振,D3SL,3225晶振 |
3.2x2.5x1.2mm |
|
27MHz |
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HCSL晶振,鸿星晶振,D3SL100E00002E,100MHz差分晶振,D3SL,3225晶振 |
3.2x2.5x1.2mm |
|
100MHz |
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HOSONIC晶振,VCXO晶振,D7SV16E0X0001E,16MHz压控晶振,D7SV,7050晶振 |
7.0×1.5×1.8mm |
|
16MHz |
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D7SV25E000003E,25MHz压控晶振,HOSONIC晶振,VCXO晶振,D7SV,5070有源晶振 |
7.0×1.5×1.8mm |
|
25MHz |
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D3SP150E00000E,150MHz差分晶振,鸿星晶振,D3SP,LV-PECL晶振,3225封装 |
3.2x2.5x1.2mm |
|
150MHz |
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鸿星晶振,D3SP156EX0001E,156.25MHz差分晶振,D3SP,LV-PECL晶振,3225贴片晶振 |
3.2x2.5x1.2mm |
|
156.25MHz |
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鸿星晶振,D3SP156EX0003E,156.25MHz差分晶振,D3SP,LV-PECL晶振,3225封装 |
3.2x2.5x1.2mm |
|
156.25MHz |
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鸿星晶振,D3SP156EX5700E,156.25MHz差分晶振,D3SP,LV-PECL晶振,3225贴片晶振 |
3.2x2.5x1.2mm |
|
156.25MHz |
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鸿星晶振,D3SP156EX000AE,156.25MHz差分晶振,D3SP,LV-PECL晶振,3225贴片晶振 |
3.2x2.5x1.2mm |
|
156.25MHz |
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